Direct Acid Copper Plating Process ; Direct acid copper plating on steel substrate ; Bright copper plating
FI-ZL001
Direct Acid Copper Plating Process
Features
• It is cyanide free acid copper plating on steel and iron substrate, especially suitable for continuous plating.
• It can be the base layer, instead of semi-bright nickel or watt nickel or cyanide alkali copper plating.
• The copper plating layer thickness could be reached more than 200μm.
• It does not contain cyanide, so it is easy to treat the wastewater and has little pollution to the environment.
• The maintenance of the bath is simple and the service life is long.
• High speed copper plating, high current efficiency, and good deep plating ability, especially suitable for reel to reel large current high-speed copper plating.
Operation conditions
| Operation conditions | Range (rack plating) | Bath make-up |
| Copper sulphate(CuSO4·6H2O) | 100～150g/L | 100g/L |
| Sulfuric acid(H2SO4) | 100～150g/L | 70g/L |
| A | 5～25ml/L | 25ml/L |
| B | 50~100ml/L | 50ml/L |
| C | 50 ~100ml/L | 50ml/L |
| Temp | 20~40℃ | 30℃ |
| Cathode current density | 1~10A/dm2 | 3A/dm2 |
| Filter | Continuous filtration | |
| Stir | Cathode rocking or air stirring | |
| Anode | Phosphor copper | |
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