Wuhan Fengfan International Trade Co.,Ltd. Products

CAS 52338-87-1 N,N'-Bis(3-(dimethylamino)propyl)urea (PU) C11H26N4O
99.5% Purity Isomeric alcohol ethoxylates Anionic surfactant with Low dosage in pretreatment for Textile and Leather industry
2-Chlorobenzaldehyde OCBA Chemical Intermediate with Molecular Formula C7H5ClO and Molecular Weight 140.6 as Colorless or Yellowish Liquid
Polyoxyethylene compound OS-8 Zinc Plating Intermediate with pH 5.0~8.0 and ≥80.0 Solid Content as Colorless to Yellowish Viscous Liquid
POLYETHYLENE GLYCOL MONO(2-ETHYLHEXYL) OX-608 Non-ionic Surfactant with ≥80% Assay 5.0-7.0 pH Colorless to Pale Yellow Transparent Liquid
OX-501 Zinc Plating Intermediate POLYETHYLENEGLYCOL OCTYL(3-SULFOPROPYL) DIETHER with Solid Content ≥75% as Low Foaming Anionic Surfactant in Light Yellow Liquid
OX-401A Low foam zinc plating carrier with PH 6.0-8.0 and solid content >60% as a red-brown transparent viscous liquid surfactant
Cyanide-free Hard Silver Electroplating Process FF-7806 with High Hardness (>120Hv) and Wide Plating Solution Bright Density Range
Cyanide-Free Chemical Silver Process for Electroless Silver Plating with pH <1.5 and Temp. 45~50℃ and Cu2+ <3000 ppm
Cyanide Free Silver Plating Chemical with pH 9-10 and 20-40℃ Operating Temperature for High Efficiency Electroplating
Chemical Gilding PCB FF-7885 with 24K Pure Gold Coating Dense Gold Layer and Good Bonding Force for Electronic Products
FF-5131 Cyanide-free Copper Plating Chemicals for Fast Deposition Stable Process and Uniform Coating
FF-7800 Cyanide Free Matte Silver Plating Process
EN 6786 High Phosphorus Electroless Nickel Plating with Fast Deposition Rate Non-Magnetic Semi-Bright to Bright Coatings
FF-6000 Bright Medium Phosphorus Electroless Nickel Process
FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating

2 3 4 5 Last Total 43 Pages