Wuhan Fengfan International Trade Co.,Ltd. Products

PN-7 Transparent Sealant Organic Protective Film with NSS Increase 20-30% and ASTMB117 Standards
PN-5 High Corrosion Resistance Sealer with Strong Coverage for Zinc Plating Passivation - Environmentally Friendly Sealant
PN-2 Water Soluble Sealant for Zinc Plating Chemicals - Hexavalent Chromium Free and Environmentally Friendly with 60~80°C Drying Temperature
TR-124 High Corrosion Protection Trivalent Chromium Passivator with U.S. GME00252 and GMW-3044 Standards Compliance
FF-7720 Sulphate Matte Tin Plating Process with High Plating Efficiency Low Metal Concentration and Good Throwing Power
FF-7705 Methylsulfonic Acid Bright Tin Plating Process with Fast Deposition Stable Process and Excellent Welding Performance
FI-7710 High-Speed Bright Tin Plating Additive for Electronic Components with Excellent Solderability and Bright Deposits
99.5% Purity Isomeric alcohol ethoxylates Anionic surfactant with Low dosage in pretreatment for Textile and Leather industry
2-Chlorobenzaldehyde OCBA Chemical Intermediate with Molecular Formula C7H5ClO and Molecular Weight 140.6 as Colorless or Yellowish Liquid
Polyoxyethylene compound OS-8 Zinc Plating Intermediate with pH 5.0~8.0 and ≥80.0 Solid Content as Colorless to Yellowish Viscous Liquid
POLYETHYLENE GLYCOL MONO(2-ETHYLHEXYL) OX-608 Non-ionic Surfactant with ≥80% Assay 5.0-7.0 pH Colorless to Pale Yellow Transparent Liquid
OX-501 Zinc Plating Intermediate POLYETHYLENEGLYCOL OCTYL(3-SULFOPROPYL) DIETHER with Solid Content ≥75% as Low Foaming Anionic Surfactant in Light Yellow Liquid
OX-401A Low foam zinc plating carrier with PH 6.0-8.0 and solid content >60% as a red-brown transparent viscous liquid surfactant
Cyanide-free Hard Silver Electroplating Process FF-7806 with High Hardness (>120Hv) and Wide Plating Solution Bright Density Range
Cyanide-Free Chemical Silver Process for Electroless Silver Plating with pH <1.5 and Temp. 45~50℃ and Cu2+ <3000 ppm
Cyanide Free Silver Plating Chemical with pH 9-10 and 20-40℃ Operating Temperature for High Efficiency Electroplating

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