Electroless Plating Thick Copper Series ; Electroless copper plating on electronic devices
Electroless Plating Thick Copper Series
Product Details
Copper Sinking Speed 3~6 μm/h, up to a maximum thickness of up to 25μm above; Low operating temperature, good stability of plating solution.
Ideal for electroless copper plating of electronic devices.
Process Specification Conditions
FF-7606A | 60ml/L |
FF-7606B | 120ml/L |
FF-7606C | 20ml/L |
FF-7606D | 40ml/L |
LD-7606E | 1ml/L |
HCHO | 7ml/L |
Temp. | 38~42℃ |