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Thick Copper Electroless Copper Plating On Electronic Devices

Thick Copper Electroless Copper Plating On Electronic Devices

  • High Light

    Thick Electroless Copper Plating

    ,

    Electronic Devices Electroless Copper Plating

    ,

    Electronic Devices thick copper plating

  • Type
    Electroless Copper Plating
  • Use
    Thick Copper Plating
  • Characteristic
    Electronic Devices
  • Item
    Chemical Auxiliary Agent
  • Place of Origin
    CHINA
  • Brand Name
    FENGFAN
  • Model Number
    FF-7606
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    Standard export packaging
  • Delivery Time
    15-25 work days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    200000pcs/day

Thick Copper Electroless Copper Plating On Electronic Devices

Electroless Plating Thick Copper Series ; Electroless copper plating on electronic devices

 

Electroless Plating Thick Copper Series

 

 

Product Details

 

Copper Sinking Speed 3~6 μm/h, up to a maximum thickness of up to 25μm above; Low operating temperature, good stability of plating solution.

 

Ideal for electroless copper plating of electronic devices.

 

Process Specification Conditions

 

FF-7606A 60ml/L
FF-7606B 120ml/L
FF-7606C 20ml/L
FF-7606D 40ml/L
LD-7606E 1ml/L
HCHO 7ml/L
Temp. 38~42℃