Electroless Copper Plating (without CH2O) ; Environmental protection formaldehyde-free chemical copper plating
Electroless Copper Plating (without CH2O)
Environment friendly electroless copper plating, the use of new reducing agent instead of traditional formaldehyde as reducing agent.
Copper sinking speed 3~6μm/h, Up to a maximum thickness of up to 25μm or above, low operating temperature, good stability of plating solution.
Process Specification Conditions