High speed Copper Plating CuSO4 Electroplating
Product Details
High current density, fast deposition speed, The coating has bright and good ductility, and the plating solution is stable.
Mainly suitable for coil-to-roll and spray plating.
Process Specification Conditions
| CuSO4·5H2O | 250～350g/L |
| H2SO4 | 35~55ml/L |
| FI-7359 | 8~20ml/L |
| Cl- | 60~100ppm |
| Temp. | 35~50℃ |
| Current density | 20~50 A/dm2 |
Our products are sold all over the world, you can rest assured.
