Weakly alkaline electroless nickel ; Electroless nickel plating on plastic surface ; FI-5420
Electroless nickel in plastic electroplating process, which can form a uniform and dense electroless Ni layer on the surface of the Palladium-activated plastic, and provide the necessary interface for the subsequent flash copper plating and copper plating.
Process Specification Conditions
| FI-5420A | 35~60ml/L |
| FI-5420B | 25~55ml/L |
| FI-5420C | 30~60ml/L |
| Solution load | 0.6~4dm2/L |
| pH | 8.8~9.2 |
| Time | 4~10 min |
| Temp. | 24~40℃ |
| Stir | Mechanical stirring |
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