Welding Wire Chemical Copper Plating Process ; High-Speed Copper Plating Additive
- FI-035A is a high-speed copper plating additive for welding wire, it is a kind of white powder, which is used for electroless deposition of high-speed copper plating on iron materials.
- The copper layer is deposited to facilitate the process of wire drawing. It can make the orderly deposition of copper ions, make the copper deposition dense, and have strong adhesion.
- It can also effectively complex the excessive iron ions in the plating bath, so that the bath is stable, and can effectively inhibit the increase of Fe2+.
- The deposited film is golden-yellow-pink, which is very popular among users. Available as dip or continuous high-speed copper plating lines. The weight of the copper film is 1-20 g/m2.
TECHNICAL FORMULATION AND OPERATING CONDITION
||30 - 50 g/l L
||40 - 60 g/L
||1 - 2 g/L
||35 - 65 ℃
||1 – 30 seconds
||2 – 5 seconds
Note: The best precipitation depends on the best temperature.