FI-5107 Non - cyanide alkaline copper plating
1. FEATURES AND ADAPT RANGE
Stable solution, high deposition efficiency, and good dispersion ability with the process, especially suitable for anti-seepage carbon and nitrogen treatment in the equipment field, as well as for the use of continuous copper plating layers that require fine crystallization. The plating solution has good adjustability, and the coating in this process is semi bright. If a bright appearance of the coating is required, it can be used in conjunction with our company's FI-5106 system to obtain a bright appearance of the coating.
1.1 Suitable for preplating of zinc alloy die-casting parts, as well as preplating of aluminum alloy substrates after zinc immersion;
1.2 Subtle layer, with small and uniform thickness differences between high and low potential coatings.
1.3 Wide range of current density and excellent coverage ability.
1.4 High tolerance for organic or inorganic impurities, easy to control.
1.5 Simple operation and control, both barrel and rack plating can be used;
2. SOLUTION COMPOSITION AND PROCESS PARAMETERS
2.1 process flow:
Pre-treatment → Activation → Water washing → Copper plating (FI-5107) → Post process (electroplating of other plating)
2.2 Composition of plating solution
Item | Range | Optimal |
FI-5107M | 800~1000ml/L | 1000ml/L |
FI-5107R | Supplementary complexing agent | |
FI-5107cu | Supplement copper ions | |
Temp. | 50~60℃ | 55℃ |
pH | >12 | >12 |
Cathode current density | 0.5~3A/dm2 | 1~2A/dm2 |
Anode | Electrolytic copper | Electrolytic copper |
Anode area: cathode area | 1.5~3﹕1 | 2.5﹕1 |
Filter | continuous | continuous |