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FI-5107 Non Cyanide Alkaline Copper Plating Chemicals

FI-5107 Non Cyanide Alkaline Copper Plating Chemicals

  • High Light

    Non Cyanide Alkaline Copper Plating

    ,

    FI-5107 Alkaline Copper Plating

    ,

    1000ml/L Alkaline Copper Plating Chemicals

  • Item
    Chemical Auxiliary Agent
  • Use
    Copper Plating
  • Feature
    Fast Deposition, Stable Process
  • Characteristic
    Cyanide-free
  • Components
    Single
  • Place of Origin
    CHINA
  • Brand Name
    FENGFAN
  • Model Number
    FI-5107
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    Standard export packaging
  • Delivery Time
    15-25 work days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    200000pcs/day

FI-5107 Non Cyanide Alkaline Copper Plating Chemicals

FI-5107 Non - cyanide alkaline copper plating

 

1. FEATURES AND ADAPT RANGE
Stable solution, high deposition efficiency, and good dispersion ability with the process, especially suitable for anti-seepage carbon and nitrogen treatment in the equipment field, as well as for the use of continuous copper plating layers that require fine crystallization. The plating solution has good adjustability, and the coating in this process is semi bright. If a bright appearance of the coating is required, it can be used in conjunction with our company's FI-5106 system to obtain a bright appearance of the coating.


1.1 Suitable for preplating of zinc alloy die-casting parts, as well as preplating of aluminum alloy substrates after zinc immersion;

1.2 Subtle layer, with small and uniform thickness differences between high and low potential coatings.

1.3 Wide range of current density and excellent coverage ability.

1.4 High tolerance for organic or inorganic impurities, easy to control.

1.5 Simple operation and control, both barrel and rack plating can be used;

2. SOLUTION COMPOSITION AND PROCESS PARAMETERS
2.1 process flow:
Pre-treatment → Activation → Water washing → Copper plating (FI-5107) → Post process (electroplating of other plating)

 

2.2 Composition of plating solution

Item Range Optimal
FI-5107M 800~1000ml/L 1000ml/L
FI-5107R Supplementary complexing agent
FI-5107cu Supplement copper ions
Temp. 50~60℃ 55℃
pH >12 >12
Cathode current density 0.5~3A/dm2 1~2A/dm2
Anode Electrolytic copper Electrolytic copper
Anode area: cathode area 1.5~3﹕1 2.5﹕1
Filter continuous continuous