Direct Acid Copper Plating Process ; Steel Substrate Acid Copper Plating Solution Bright Copper Plating
Features
• It is cyanide free acid copper plating on steel and iron substrate, especially suitable for continuous plating.
• It can be the base layer, instead of semi-bright nickel or watt nickel or cyanide alkali copper plating.
• The copper plating layer thickness could be reached more than 200μm.
• It does not contain cyanide, so it is easy to treat the wastewater and has little pollution to the environment.
• The maintenance of the bath is simple and the service life is long.
• High speed copper plating, high current efficiency, and good deep plating ability, especially suitable for reel to reel large current high-speed copper plating.
BATH COMPOSITION AND OPERATION CONDITION
| Operation conditions | Range (rack plating) | Bath Make-up | ||
| Rendering copper | Thick copper | Bright copper | ||
| Copper sulphate(CuSO4·5H2O) | 80 ～ 250 g/L | 100 g/L | 100 g/L | 200 g/L |
| Sulfuric acid(H2SO4) | 60 ～ 100 g/L | 70 g/L | 80 g/L | 60 g/L |
| FI-ZL001 A | 5 ～ 25 ml/L | — | — | 3 ml/L |
| FI-ZL001 B | 50 ～ 100 ml/L | 50 ml/L | 100 ml/L | — |
| FI-ZL001 C | 50 ～ 100 ml/L | 50 ml/L | 100 ml/L | — |
| Temperature | 20 ～ 40 ℃ | 30 ℃ | 30 ℃ | 30 ℃ |
| Cathode current density | 1 ～ 10 A/dm2 | 1~3 A/dm2 | 3 A/dm2 | 3~10 A/dm2 |
| Filter | Continuous filtration | |||
| Agitation | Cathode movement or air agitation | |||
| Anode | Phosphor copper | |||
| Cathode | Anode and Cathode area ratio in 2:1 | |||
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