FI-BPA1 Colloidal Palladium Activator Pretreatment Of Electroless Plating On Plastics

Colloidal palladium activator ; Pretreatment of electroless plating on plastics

FI-BPA1

FI-BPA1 is a colloidal palladium activator suitable for ABS direct electroplating and ABS / PC plastic electroless plating. It has high activity. Matched with electroless nickel plating, the palladium content used in the activation solution is very low (10-25mg / L) and the consumption is small. FI-BPA1 activator can form a uniform activation center on the plastic surface. The workpiece shall be directly put into the activation solution after pre immersion.

1.Bath composition and Operation condition

3. Explain

1. The consumption of activator depends on the workpiece area and the amount of liquid carried out. After each 0.1m² workpiece area is treated, about 0.15-0.25ml activator FI-BPA1 needs to be supplemented;
2. When the liquid level of the activation bath decreases, it can be supplemented with diluted 20-30% pure hydrochloric acid.;
3. During use or long-term shutdown, divalent tin (SN²⁺) will be oxidized to Sn⁴⁺, so it must be analyzed and supplemented regularly to keep the concentration of SN²⁺ in the activation solution at 1-3g / L, and the concentration of divalent tin can be supplemented with reagent grade stannous chloride;
4. Regularly determine the content of FI-BPA1 in the activation solution by colorimetry and supplement it.