FI-9210 Indium Column Plating Solution for Semiconductor Wafer with Wide Current Density Range and Uniform Plating
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Highlight
Wide current density range Indium Column Plating Solution
,Uniform plating FI-9210
,Excellent bump thickness Semiconductor Wafer Plating Chemical
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UseIndium Column Plating
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Type2.5D/3D Packaging Applications
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ItemChemical Auxiliary Agent
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CharacteristicSemiconductor Wafer Plating
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Place of OriginCHINA
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Brand NameFENGFAN
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Model NumberFI-9210
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Minimum Order QuantityNegotiable
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PriceNegotiable
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Packaging DetailsStandard export packaging
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Delivery Time15-25 work days
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Payment TermsL/C,D/A,D/P,T/T,Western Union,MoneyGram
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Supply Ability200000pcs/day
FI-9210 Indium Column Plating Solution for Semiconductor Wafer with Wide Current Density Range and Uniform Plating
Indium Column Plating Wafer Post-Processing Workflow FI-9210
FI-9210 Indium Column Plating Solution
FI-9210 Indium Column Plating Solution is a newly formulated composition specifically designed for semiconductor wafer plating processes. It is suitable for reflow-solderable bump fabrication in flip-chip packaging and 2.5D/3D packaging applications.
The highly efficient and stable plating system is engineered for rapid deposition of pure indium columns or uniformly sized indium grains across a broad current density range. This next-generation product delivers industry-leading plating performance, bath stability, and maximum ease of operation.
Product Features
- Wide operating current density range
- Uniform plating unaffected by substrate geometry
- Excellent bump thickness and uniformity
- Analysable additives for simplified bath maintenance
Bath Preparation Procedure
1. Pre-dip Bath
Pre-dip agent: Prepare tank with 100% undiluted solution.
2. Electroplating Bath
| Preparation Products | Quantity |
|---|---|
| FI-9210 Indium Concentrate | 335 mL/L |
| MSA Acid | 60 mL/L |
| FI-9211 Indium Additive | 100 mL/L |
| Pure Water | 505 mL/L |
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