FI-9210 Indium Column Plating Solution

 FI-9210 Indium Column Plating (Wafer Post-Processing Workflow)

FI-9210 Indium Column Plating Solution is a newly formulated composition specifically designed for semiconductor wafer plating processes. It is suitable for reflow-solderable bump fabrication in flip-chip packaging and 2.5D/3D packaging applications.

The highly efficient and stable plating system is engineered for rapid deposition of pure indium columns or uniformly sized indium grains across a broad current density range. This next-generation product delivers industry-leading plating performance, bath stability, and maximum ease of operation.

Product Features:

- Wide operating current density range

- Uniform plating unaffected by substrate geometry

- Excellent bump thickness and uniformity

- Analysable additives for simplified bath maintenance

Equipment Requirements:

1. Plating Vessel: Constructed from PP, PVC, PVDC, linear polypropylene, or high-density polyethylene.

2. Anodes: Indium balls within titanium baskets must be fully loaded to ensure adequate anode corrosion; titanium baskets require anode bags.

3. Ventilation: Recommended.

4. Heaters: Select PTFE, quartz, or titanium heaters; equipped with low-level cut-off and earth leakage circuit breakers recommended.

5. Filtration: 0.1 - 0.45μm PP filter cartridges.

Bath Preparation Procedure

1.  Pre-dip Bath

Pre-dip agent: Prepare tank with 100% undiluted solution.

2.  Electroplating Bath