FF-7608 Formaldehyde Free Copper Plating Chemicals Electroless Copper Plating Without CH2O

FF-7608 is a high-speed formaldehyde free chemical plating thick copper process with internationally leading water quality. The product has the characteristics of low operating temperature of the plating solution, high stability, fast deposition speed, fine coating, excellent coating force, excellent adhesion, simple tank management, easy treatment of complexing agents, and no cyanide. It can be plated with a thick copper layer that is finely crystallized and has strong adhesion. It can be used as a pre copper plating process or as the final copper layer coating on the workpiece.

This product is widely used for the metalization of molded interconnect components (MID) for various electronic component chips, microelectronics, laser engraving (LDS), and two-point injection molding (2 Shots). It is also applicable to the production of copper layers on substrate products such as steel, aluminum alloys, zinc alloys, magnesium alloys, and various catalytic workpieces after treatment.