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acid zinc plating chemicals
,zinc plating brightener
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TypeCopper Plating
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ItemChemical Auxiliary Agent
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UseElectroless Copper Plating
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Place of OriginChina
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Brand NameFENGFAN
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Model NumberTR-124,TR-125,TR-138
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Minimum Order QuantityNegotiable
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PriceNegotiable
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Packaging DetailsStandard export packaging
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Delivery Time15-25 work days
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Payment TermsL/C,D/A,D/P,T/T,Western Union,
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Supply Ability200000pcs/day
FF-Cu85 Electroless Copper Plating Process
FF-Cu85 Electroless Copper Plating Process
Description
The FF-Cu85 process is a medium-temperature, high-speed electroless copper deposition system specifically engineered for through-hole metallization applications. It deposits a copper coating with high purity, smooth surface, uniform density, and consistent distribution. When operated according to the procedure detailed below and measured using rate panels, FF-Cu85 deposits a coating thickness of 1.75 to 2.25 µm (70 to 90 µin) within 30 minutes. The FF-Cu85 bath exhibits exceptional stability and, with proper maintenance, operates continuously and reliably over extended periods.
Please read the full Technical Data Sheet prior to using this product.
Process Components
FF-Cu85A, FF-Cu85B, FF-Cu85C, FF-Cu85D,FF-Cu85G, 37% Formaldehyde
Fresh Bath Makeup Recipe
|
Component |
Volumetric Percentage |
Quantity per Liter |
|
DI Water or Distilled Water |
82.3% |
823 mL / L |
|
FF-Cu85B |
10.0% |
100 mL / L |
|
FF-Cu85A |
4.0% |
40 mL / L |
|
FF-Cu85D |
3.0% |
30 mL / L |
|
FF-Cu85G |
0.2% |
2 mL / L |
|
37% Formaldehyde * |
0.5% |
5 mL / L |
Our products are sold all over the world, you can rest assured.
