Chip components pure tin plating ; Alkasulfonic acid system matte pure tin FI-SMD
Alkasulfonic acid system matte pure tin electroplating process. Specially applied to the electroplating of chip components. The process has good dispersion ability and deep plating ability.
FI-SMD Sn Conc. 25~60ml/L
FI-SMD C.S 120~180ml/L
FI-SMD A.S 50~100g/L
FI-SMD A 40~100ml/L
Temp. 18~40℃