High Speed Silver Plating(cyanide-free) ; High speed cyanide free silver plating process
Product Details
The coating is dense and bright, and has excellent solder ability and corrosion resistance.
Widely used in semiconductor materials, integrated circuits, connectors and converters high-speed electroplating.
Process Specification Conditions
AgNO3 | 60~80g/L |
FF-7808A | 20~30ml/L |
FF-7808Mu | 800ml/L |
pH | 9.0~10.0 |
Temp. | 20~35℃ |
Current density | 20~80 A/dm2 |