FF-7702 Bright Acid Tin Plating Process
FF-7702 bright tin plating process does not contain formaldehyde, is a low foaming sulphate tin plating process, can produce a bright silver-white ductile tin plating layer, suitable for barrel and rack plating process.
1. Features and application
Add special effect antioxidants to effectively extend the service life of the bath;
Formaldehyde-free, low-foam tin plating process;
Good solderability and uniform plating for electronic plating;
The coating performance is stable;
Does not corrode insulators such as ceramics and lead glass.
2. Operating conditions
| Item | Range | Optimal |
| Stannous sulfate | 20～40g/L | 30 |
| Sulfuric acid (H2SO4) | 150～170g/L | 160 |
| FF-7702A | 20～40ml/L | 30 |
| FF-7702B | 0.5～3ml/L | 2 |
| Temp | 5～20℃ | 15～20℃ |
| Cathode current density(rack plating) | 1.0～3.0 A/dm2 | 2.0A/dm2 |
| Cathode current density(barrel plating) | 0.3～1.0 A/dm² | 0.5 A/dm² |
| Anode current density | 0.5～2.0 A/dm² | 1.0 A/dm² |
| Stirring (cathode rocking) | 3～4m/min | 3～4m/min |
| Filter | Continuous | Continuous |
| Plating speed | 1µm/min (2 A/dm²) |
3. Preparation of solution
Clean the plating tank, filter pump, anode and anode bags with 10% (v/v) sulfuric acid, then wash thoroughly with water;
Add 50% of the required volume of deionized water or distilled water to the tank, and add the required amount of sulfuric acid while stirring (the corresponding protective measures must be taken when adding sulfuric acid);
Put a few tin bars in the solution, add the required amount of stannous sulfate while stirring, and stir the solution to a temperature not exceeding 50℃ until completely dissolved;
Add deionized water or distilled water to the final volume;
After the plating solution is cooled to room temperature, add FF-7702A, B while stirring;
For best performance, a small current electrolytic of 2 to 3 Ah/L is recommended.
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