FI-7710 High-Speed Bright Tin Plating Additive for Electronic Components with Excellent Solderability and Bright Deposits
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Highlight
High-Speed Plating Bright Tin
,Bright Deposits Tin Plating
,Excellent Solderability Electronic Plating
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TypeBright Tin Plating
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UseTin Plating
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ItemChemical Auxiliary Agent
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FeatureHigh Speed Plating
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Place of OriginCHINA
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Brand NameFENGFAN
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Model NumberFF-7710
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Minimum Order QuantityNegotiable
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PriceNegotiable
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Packaging DetailsStandard export packaging
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Delivery Time15-25 work days
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Payment TermsL/C,D/A,D/P,T/T,Western Union,MoneyGram
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Supply Ability200000pcs/day
FI-7710 High-Speed Bright Tin Plating Additive for Electronic Components with Excellent Solderability and Bright Deposits
FI-7710 High-Speed Bright Tin Plating
Product Description
FI-7710 is designed for high-speed or continuous bright tin plating of electronic components, strip materials, and similar substrates. This additive delivers deposits with low organic content, excellent brightness, and superior solderability across a broad range of bath temperatures. The surface morphology of deposits produced by the FI-7710 process is uniformly stable.
Characteristics and Applications
- Incorporates specialized antioxidants to significantly extend bath life; formaldehyde-free, low-foaming tin plating process
- Excellent solderability and uniform brightness suitable for high-speed or continuous electronic plating
- Stable coating properties; does not corrode insulators such as ceramics or lead glass
Process Preparation - Bath Opening
| Component | Amount |
|---|---|
| Methylsulfonic acid stannous salt | 167ml/L |
| Methylsulfonic acid (70%) | 200ml/L |
| FI-7710M | 100ml/L |
Please read the technical data sheet carefully before using this product.
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