FF-5101 Non-Cyanide alkaline thick Copper Process

Good stability of the plating solution and high deposition efficiency; high current efficiency, good dispersing ability which is especially suitable for seepage carbon and nitrogen treatment in the field of equipment, and also suitable for the use of continuous copper plating requiring careful crystallization. The coating is adjustable, and the coating is semi-bright. cyanide-free formula greatly reduces the pollution of the environment; the plating layer has good weldability, good conductivity, and good resistance to discolouration; and it can be applied in the industries of electrical appliances, electronics, telecommunication equipments, and instrument and meter manufacturing.

1. The coating of this process is fine and dense, and the thickness difference of high and low potential coating is small and uniform.
2. Wide range of current density and excellent coverage ability.
3. Organic or inorganic impurities have a high tolerance and are easy to control.
4. Simple operation control, can hang or roll plating;

Pre-treatment activated washing copper plating (FF-5101) (plating other seeds). Plating solution components: