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OX-401A Low foam zinc plating carrier with PH 6.0-8.0 and solid content >60% as a red-brown transparent viscous liquid surfactant
Cyanide-Free Chemical Silver Process for Electroless Silver Plating with pH <1.5 and Temp. 45~50℃ and Cu2+ <3000 ppm
FF-5131 Cyanide-free Copper Plating Chemicals for Fast Deposition Stable Process and Uniform Coating
FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating
High Temperature Zn-618 Brightener for Acidic Zinc Plating with High Gloss and Good Leveling Ability
FFI-22 Bright Acid Copper Plating Additive for Barrel Plating with Bright Deposit and Uniform Fine-Grained Finish
Blue White Passivation trivalent chrome plating process With High Corrosion Resistance
OX-108 Sulfonic Ammonium Salt Anionic Surfactant Potassium Chloride Zinc Plating
CAS 68555-36-2 WT Polyquaternium-2 Yellowish To Yellow Liquid
Colorless Liquid CAS 100-44-7 Benzyl Chloride C7H7Cl
CAS 68797-57-9 Imidazole-Epichlorodydrin Copolymer(IZE) C6H9ClN2O
CAS 1633-83-6 1,4-Butane Sultone 1,4-BS C4H8O3S
FI-116 Environment Friendly Chrome Mist Inhibitor Chrome Plating Chemicals Fluoride Free And White Powder
CAS 1120-71-4 1,3-Propane Sultone (1,3-PS) C3H6O3S
CAS 1072-53-3 1,3,2-Dioxathiolane 2,2-Dioxide DTD Electrolyte Additives
CAS 51099-80-0 N-(3-Sulfopropyl)-Saccharin Sodium Salt(SAPS) For Electrodeposited Cu Foils

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